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NXP Semiconductors
SSL1623PH
SMPS IC for mains LED drivers
13. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
D
A 2
A
M E
SOT38-1
L
A 1
c
Z
e
b 1
w M
(e 1 )
b
16
1
pin 1 index
9
8
E
M H
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
mm
inches
A
max.
4.7
0.19
A 1
min.
0.51
0.02
A 2
max.
3.7
0.15
b
1.40
1.14
0.055
0.045
b 1
0.53
0.38
0.021
0.015
c
0.32
0.23
0.013
0.009
D (1)
21.8
21.4
0.86
0.84
E (1)
6.48
6.20
0.26
0.24
e
2.54
0.1
e 1
7.62
0.3
L
3.9
3.4
0.15
0.13
M E
8.25
7.80
0.32
0.31
M H
9.5
8.3
0.37
0.33
w
0.254
0.01
Z (1)
max.
2.2
0.087
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
ISSUE DATE
SOT38-1
050G09
MO-001
SC-503-16
99-12-27
03-02-13
Fig 6.
Package outline DIP16
SSL1623PH
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 13 September 2010
? NXP B.V. 2010. All rights reserved.
12 of 18
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